Director of System Integration

About the role

We are seeking a Director of Systems Integration to lead, build, and scale the engineering organization responsible for deploying our quantum technology with top‑tier global partners. The role owns major quantum hardware and system integration programs, managing system engineering teams and serving as the executive engineering interface to strategic enterprise partners.

Key responsibilities

• Recruit, manage, and mentor senior technical leads and engineers across Systems Engineering, HPC Integration, Ecosystem Management, Advanced Packaging, and RF Engineering.
• Own end‑to‑end delivery of multi‑year commercial quantum hardware integration projects involving partner co‑design.
• Build and maintain relationships with senior engineering leadership at customer and partner organizations.
• Identify and de‑risk technical, timeline and cost mismatches across third‑party hardware suppliers and integration partners.
• Establish, mature and scale standardized engagement frameworks, partner training programs, and logistics for integration projects.
• Collaborate with Business Development to evaluate technical feasibility, resource allocation, and timeline alignment on strategic proposals.

Required profile

• Master’s or PhD in Systems Engineering, Electrical Engineering, Applied Physics, Microelectronics, or Computer Engineering.
• 10+ years of technical leadership experience with direct people management of multidisciplinary engineering teams in complex hardware environments.
• Proven track record delivering customer‑facing, multi‑disciplinary projects that involve close technology integration and high‑capital equipment deployment.
• Deep domain expertise in HPC systems integration, advanced semiconductor packaging, or supercomputing infrastructure (thermal budgets, high‑density RF routing, cryogenics, compute scaling).
• Exceptional cross‑functional communicator able to bridge strategic business goals with hardware constraints and present to executive leadership.
• Proactive, detail‑oriented leader who thrives in a fast‑paced environment and excels at building high‑performing engineering teams.

Required skills

• Systems Engineering
• HPC Integration
• Advanced Semiconductor Packaging
• RF Engineering
• Cryogenics
• Thermal Budget Management
• High‑Density RF Signal Routing
• Compute Scaling

What we offer

• Competitive salary with 8% holiday allowance.
• Generous pension plan covering partners and dependents.
• Hybrid work model with flexible, outcome‑based vacation policy.
• Personal development budget for learning and growth.
• Team events, off‑sites and a collaborative culture.
• Commitment to diversity and inclusion throughout the recruitment process.