Advanced Packaging Lead

About the role

As an Advanced Packaging Lead you will play a crucial role in developing state‑of‑the‑art assembly technologies for quantum processors built on our multi‑layer chip‑stack architecture. You will define fabrication and process development projects, design experiments and ensure seamless integration of all technical components as we scale to increasingly complex quantum systems.

Key responsibilities

• Plan and lead back‑end fabrication and assembly technology development, focusing on flip‑chip bonding, contact reliability and manufacturability.
• Develop and coordinate integration test plans together with cross‑functional teams.
• Lead the definition and formalisation of assembly‑centric fabrication and process development across the organisation.
• Establish scalable, well‑documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and performance targets.

Required profile

• 4+ years of experience in chip assembly development of deep‑tech or low‑volume technology, preferably flip‑chip in quantum computing.
• Hands‑on experience with back‑end process‑flow development, specifically UBM, hard‑stops, bumps, detachable contacts / MEMS, and flip‑chip technologies.
• Background in superconducting qubits is a significant plus.
• Background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus).

Required skills

• Flip‑chip bonding techniques
• Back‑end process‑flow development
• Under‑bump metallisation (UBM)
• Hard‑stop and bump formation
• Detachable contacts / MEMS integration

What we offer

• Competitive salary with 8% holiday allowance
• Generous pension plan covering partners and dependents
• Hybrid work model with flexible, outcome‑based schedule and open vacation policy
• Personal development budget for learning and growth
• Team events, off‑sites and a strong focus on diversity & inclusion